MUBW30-12A6K
Ouput Inverter T1 - T6
Ratings
Symbol
V CES
V GES
V GEM
I C25
I C80
P tot
Definitions
collector emitter voltage
max. DC gate voltage
max. transient collector gate voltage
collector current
total power dissipation
Conditions
continuous
transient
T VJ = 25°C to  50°C
T C = 25°C
T C = 80°C
T C = 25°C
min.
typ.
max.
 200
±20
±30
30
 30
Unit
V
V
V
A
A
W
V CE(sat)
V GE(th)
I CES
collector emitter saturation voltage
gate emitter threshold voltage
collector emitter leakage current
I C = 30 A; V GE =  5 V
I C = 0.6 mA; V GE = V CE
V CE = V CES ; V GE = 0 V
T VJ = 25°C
T VJ =  25°C
T VJ = 25°C
T VJ = 25°C
T VJ =  25°C
4.5
3.0
3.4
 .5
3.8
6.5
 
V
V
V
mA
mA
I GES
C ies
Q G(on)
gate emitter leakage current
input capacitance
total gate charge
V CE = 0 V; V GE = ±20 V
V CE = 25 V; V GE = 0 V; f =   MHz
V CE = 600 V; V GE =  5 V; I C =  7.5 A
 000
70
200
nA
pF
nC
t d(on)
t r
t d(off)
t f
E on
E off
turn-on delay time
current rise time
turn-off delay time
current fall time
turn-on energy per pulse
turn-off energy per pulse
inductive load
V CE = 600 V; I C =  5 A
V GE = ± 5 V; R G = 82 W
T VJ =  25°C
 00
80
500
70
2.3
 .8
ns
ns
ns
ns
mJ
mJ
I CM
reverse bias safe operating area
RBSOA; V GE = ± 5 V; R G = 82 W
L =  00 μH; clamped induct. load T VJ =  25°C
V CEmax = V CES - L S · di/dt
45
A
t SC
(SCSOA)
R thJC
R thCH
short circuit safe operating area
thermal resistance junction to case
thermal resistance case to heatsink
V CE =  200 V; V GE = ± 5 V;
R G = 82 W ; non-repetitive
(per IGBT)
(per IGBT)
T VJ =  25°C
 0
0.35
0.95
μs
K/W
K/W
Output Inverter D1 - D6
Ratings
Symbol
V RRM
I F25
I F80
V F
I RM
t rr
E rec(off)
Definitions
max. repetitve reverse voltage
forward current
forward voltage
max. reverse recovery current
reverse recovery time
reverse recovery energy
Conditions
I F = 30 A; V GE = 0 V
V R = 600 V
di F /dt = -500 A/μs
I F = 30 A; V GE = 0 V
T VJ =  50°C
T C = 25°C
T C = 80°C
T VJ = 25°C
T VJ =  25°C
T VJ =  25°C
min.
typ.
2.0
27
 50
tbd
max.
 200
49
32
2.9
Unit
V
A
A
V
V
A
ns
μJ
R thJC
R thCH
thermal resistance junction to case
thermal resistance case to heatsink
(per diode)
(per diode)
0.3
0.9
K/W
K/W
T C = 25°C unless otherwise stated
IXYS reserves the right to change limits, test conditions and dimensions.
? 2007 IXYS All rights reserved
2007   3a
2-5
相关PDF资料
MUBW35-06A6 MODULE IGBT CBI E1
MUBW35-12A7 MODULE IGBT CBI E2
MUBW35-12A8 MODULE IGBT CBI E3
MUBW40-12T7 MODULE IGBT CBI E2
MUBW45-12T6K MODULE IGBT CBI E1
MUBW50-06A7 MODULE IGBT CBI E2
MUBW50-06A8 MODULE IGBT CBI E3
MUBW50-12A8 MODULE IGBT CBI E3
相关代理商/技术参数
MUBW30-12A6K 功能描述:分立半导体模块 30 Amps 1200V RoHS:否 制造商:Infineon Technologies 产品:Thyristor Power Modules 类型:Phase Controls 安装风格:Screw 封装 / 箱体:DT61 封装:
MUBW30-12E6K 功能描述:分立半导体模块 30 Amps 1200V RoHS:否 制造商:Infineon Technologies 产品:Thyristor Power Modules 类型:Phase Controls 安装风格:Screw 封装 / 箱体:DT61 封装:
MUBW35-06A6 功能描述:MODULE IGBT CBI E1 RoHS:是 类别:半导体模块 >> IGBT 系列:- 标准包装:10 系列:GenX3™ IGBT 类型:PT 配置:单一 电压 - 集电极发射极击穿(最大):600V Vge, Ic时的最大Vce(开):1.4V @ 15V,100A 电流 - 集电极 (Ic)(最大):430A 电流 - 集电极截止(最大):100µA Vce 时的输入电容 (Cies):31nF @ 25V 功率 - 最大:1000W 输入:标准 NTC 热敏电阻:无 安装类型:底座安装 封装/外壳:SOT-227-4,miniBLOC 供应商设备封装:SOT-227B
MUBW35-06A6K 功能描述:分立半导体模块 35 Amps 600V RoHS:否 制造商:Infineon Technologies 产品:Thyristor Power Modules 类型:Phase Controls 安装风格:Screw 封装 / 箱体:DT61 封装:
MUBW35-12A7 功能描述:分立半导体模块 35 Amps 1200V RoHS:否 制造商:Infineon Technologies 产品:Thyristor Power Modules 类型:Phase Controls 安装风格:Screw 封装 / 箱体:DT61 封装:
MUBW35-12A8 功能描述:分立半导体模块 35 Amps 1200V RoHS:否 制造商:Infineon Technologies 产品:Thyristor Power Modules 类型:Phase Controls 安装风格:Screw 封装 / 箱体:DT61 封装:
MUBW35-12E7 功能描述:分立半导体模块 35 Amps 1200V RoHS:否 制造商:Infineon Technologies 产品:Thyristor Power Modules 类型:Phase Controls 安装风格:Screw 封装 / 箱体:DT61 封装:
MUBW40-12T7 功能描述:分立半导体模块 40 Amps 1200V RoHS:否 制造商:Infineon Technologies 产品:Thyristor Power Modules 类型:Phase Controls 安装风格:Screw 封装 / 箱体:DT61 封装: